Process Capability

  • Project

    Shenzhen Bomin

    Meizhou Bomin

    Jiangsu Bomin

  • HDI Structure

    /

    ELIC(2-8step)

    ELIC(4-7step)

  • Impedance Control Tolerance

    ±8%

    ±8%

    ±8%

  • Max.Board/Array Size (Universal ET)

    2L:2000mm*500mm (78.7402"*19.6850")≥4L:1150mm*430mm (45.2755"*16.93")

    500*580mm    (19.66"*22.83")

    480mm*580mm (18.90"*22.83")

  • Min.BGA Pad Pitch

    0.30mm(0.0118")

    0.40mm(0.0157")

    0.38mm(0.0150")

  • Min.SMT/QFP Pad Pitch

    0.250mm(0.0100")

    0.250mm(0.0100")

    0.250mm(0.0100")

  • Max.Test Points/Board (Universal ET)

    Bed-of-Nail Testing :15000                

    Flying Probe:Unlimited 


     Bed-of-Nail Testing:40000           

     Flying Probe:Unlimited  


    Bed-of-Nail Testing  :16000                 

    Flying Probe:Unlimited  


  • Solder Mask Registration

    ±0.038mm(±0.0015")

    ±0.025mm(±0.0010")

    ±0.02mm(±0.0008")

  • Min.Solder Mask Dam

    0.076mm(0.0030")

    0.076mm(0.0030")

    0.05mm(0.0020")

  • Layer to Layer Registration

    ±0.038mm(±0.0015")

    ±0.05mm(±0.0020")

    ±0.038mm(±0.0015")

  • Min.Line Width

    0.05mm(0.0020")

    0.045mm(0.0018")

    0.035mm(0.0014")

  • Line Width Control Tolerance

    ±0.02mm

    ≤4milLine:±0.015mm (±0.0006")>4milLine:±10%

    ≤4milLine:±0.015mm (±0.0006")>4milLine:±10%

  • Aspect Ratio

    15:1

    15:1

    8:1

  • Min.Laser Via Size

    0.10mm(±0.0039")

    0.075mm(0.0030")

    0.075mm(±0.0030")

  • Min.Machanical Drill Size

    0.15mm(0.0059")

    0.15mm(0.0059")

    ±0.15mm(±0.0059")

  • NPTH Tolerance

    ±0.038mm(±0.0015")

    ±0.038mm(±0.0015")

    ±0.038mm(±0.0015")

  • PTH Tolerance

    ±0.05mm(±0.0020")

    ±0.05mm(±0.0020")

    ±0.05mm(±0.0020")

  • Dimple of POFV

    /

    ≤10μm

    ≤10μm

  • V-CUT Edge to Edge Accuracy

    ±0.05mm(±0.0020")

    ±0.1mm(±0.0040")

    ±0.05mm(±0.0020")

  • Punching Shear Tolerance

    ±0.075mm(±0.0030")

    ±0.075mm(±0.0030")

    /

  • Rounting Edge to Edge Accuracy

    ±0.10mm(±0.0040")

    ±0.05mm(±0.0020")

    ±0.075mm(±0.0030"

  • Back Drill Tolerance

    ±0.05mm(±0.0020")

    ±0.05mm(±0.0020")

    ±0.05mm(±0.0020")

  • Drilling Hole to Hole Accuracy

    ±0.05mm(±0.0020")

    ±0.05mm(±0.0020")

    ±0.05mm(±0.0020")

  • Max.Cu Thickness(Base)

    420μm(12OZ)

    Thickness of copper plate:5mm


    105μm(3oz)

    70μm(2oz)

  • Min.Cu Thickness(Base)

    9μm(1/4OZ)

    9μm(1/4oz)

    9μm(1/4oz)

  • Min.Core Thickness

    0.05mm(0.0020")

    0.05mm(0.0020")

    0.05mm(0.0020")

  • Max.Overall Board Thickness

    6.0mm(0.2362")

    8.0mm(0.1573")

    2.0mm(0.0630")

  • Min.Overall Board Thickness

    2L:0.15mm(0.0059")        4L:0.30mm(0.0118")

    2L:0.12mm(0.0047")     4L:0.20mm(0.0079")

    0.2mm(0.008")

  • Max.Panel Size

    2L:2130mm*500mm (83.8582"*19.6850")≥4L:1250mm*500mm (49.2126"*19.6850")

    544*620mm   (21.4173"*24.4094")

    615mm*762mm      (24.2125"*30.0000")

  • Max.Layer Count

    30L

    36L

    14L